Main Application
• Glass Fiber Copper Clad Laminates. (FR-4、CEM-1、CEM-3、High-Tg、HF)• Multi-Layer Printed Circuit Board.
Product Specification
|
Item |
Unit | Value | Test Method | |||||||||||
| Nominal Thickness | µm | 9 | 12 | 15 | 18 | 35 | 50 | 70 | 105 | 140 | 175 | 210 |
- |
|
| oz | 1/4 | 1/3 | 3/7 | 1/2 | 1 | 1.5 | 2 | 3 | 4 | 5 | 6 | |||
|
Thickness by weight |
g/m² | 76±5% | 107±5% | 125±5% | 153±5% | 285±5% | 435±5% | 585±5% | 890±5% | 1220±5% | 1500±5% | 1800±5% | IPC-TM650 | |
| Purity | % | ≧99.8 | ≧99.8 | ≧99.8 | ≧99.8 | ≧99.8 | ≧99.8 | ≧99.8 | ≧99.8 | ≧99.8 | ≧99.8 | ≧99.8 | IPC-TM650 | |
| Tensile Strength | at RT | kg/mm² | ≧21 | ≧21 | ≧21 | ≧21 | ≧28 | ≧28 | ≧28 | ≧21 | ≧21 | ≧21 | ≧21 | IPC-TM-650 |
| at 180℃ | kg/mm² | ≧15 | ≧15 | ≧15 | ≧15 | ≧15 | ≧15 | ≧15 | ≧16 | ≧16 | ≧16 | ≧16 | ||
| Elongation | at RT | % | ≧3 | ≧3 | ≧3 | ≧4 | ≧5 | ≧5 | ≧5 | ≧5 | ≧5 | ≧5 | ≧5 | IPC-TM-650 |
| at 180℃ | % | ≧2 | ≧2 | ≧2 | ≧3 | ≧3 | ≧3 | ≧3 | ≧3 | ≧3 | ≧3 | ≧3 | ||
| Roughness of Shiny side (Ra) | µm | ≦0.43 | ≦0.43 | ≦0.43 | ≦0.43 | ≦0.43 | ≦0.43 | ≦0.43 | ≦0.43 | ≦0.43 | ≦0.43 | ≦0.43 | IPC-TM-650 | |
| Ronghness of Matte side (Rz) | µm | ≦6 | ≦7 | ≦8 | ≦9 | ≦10 | ≦12 | ≦11 | ≦12 | ≦13 | ≦14 | ≦15 | IPC-TM-650 | |
| Peel Strength | kg/cm | ≧0.9 | ≧1.1 | ≧1.1 | ≧1.3 | ≧1.7 | ≧1.7 | ≧1.9 | ≧2.0 | ≧2.0 | ≧2.0 | ≧2.0 | IPC-TM-650 | |
| lb/in | ≧5.0 | ≧6.0 | ≧6.0 | ≧7.3 | ≧9.5 | ≧9.5 | ≧10.6 | ≧11.2 | ≧11.2 | ≧11.2 | ≧11.2 | |||